Electronics

Semiconductors have revolutionized the electronics recycling industry, and diodes and hybrid pixel detectors are at the forefront of this transformation. Through their application in X-ray fluorescence (XRF) analysis, these advanced technologies enable the non-destructive determination of the elemental composition of materials. With diodes capturing emitted characteristic X-rays in high energy resolution, and hybrid pixel detectors capturing X-ray signals with exceptional sensitivity and spatial resolution, these detectors provide valuable insights for identifying and separating different materials during the recycling process.

Advancing Non-Destructive Testing (NDT) with Hybrid Pixel Detectors

Detecting Microelectronic Component Defects: Hybrid pixel detectors are increasingly employed in the non-destructive testing (NDT) of electronics, with a particular focus on microelectronic components such as integrated circuits, electronic packages, and printed circuit boards. By utilizing X-ray imaging, these detectors enable the identification of hidden defects that elude naked eye observation, including cracks, voids, and delaminations. With their superior spatial resolution and sensitivity, hybrid pixel detectors ensure accurate and reliable detection of even the smallest defects.

High-Speed Imaging for Efficient Inspection

One key advantage of employing hybrid pixel detectors for NDT of electronics is their ability to capture high-quality images at high speeds. This capability is invaluable when inspecting large volumes of components, allowing for quick and accurate assessment. Moreover, these detectors can be utilized with different X-ray energies, enabling the detection of defects across materials with varying thicknesses and densities.

Unveiling Hidden Defects with Computed Tomography (CT) Scanning

Identifying and Locating Defects in Electronic Components: Hybrid pixel detectors find application in computed tomography (CT) scanning of electronics—a non-destructive imaging technique that generates three-dimensional images of an object’s internal structure. By leveraging hybrid pixel detectors in CT scanning, it becomes possible to accurately identify and locate defects within electronic components. With their exceptional accuracy and resolution, these detectors provide critical insights for quality assurance and reliability.