Probing of the modules under X-ray fluorecense photons allows full characterization of the flip chip bonded Si, GaAs and CdTe modules.
AdvaFab has three X-ray probers for testing of Timepix1, Timepix3 and Medipix3 sensor modules. It is possible identify the flip chip bonding quality, functionality of the ASIC, stability of the sensor and see intrinsic defects in the sensors on every module before delivering it to our customer. Moreover, the stability of the pixels can be measured over time. The sensor is irradiated by fluorescence photons of the target. Available targets are Fe (6 keV), Cu (8 keV), Cd (23 keV) and In (24 keV).
The detailed module-level testing enables us to confirm the quality of the modules before dispatching them to our customers. If the tested module is bad, we will repair it on-site and reduce the costs of bad quality. Because of the improved testing our customers will save labour and materials and logistics costs. The X-ray probing process doesn’t cause any mechanical damage to the sensor chips.