AdvaFab deliver thin film Under-Bump Metallization (UBM) pads on sensor wafers. The role of the UBM is to:
- Provide good and reliable surface finishing for soldering
- Act as diffusion barrier against the components of the solder alloy
- Provide good adhesion to the wafer.
The AdvaFab-deposited UBM pads are compatible with InSn, SnPb, AgSn and other typical solder alloys. The UBM pads have been designed to allow flip chip bonding of multiple dies on the chips and rework of some chips.