AdvaFab has been specialized in depositing of the low-melting point, indium-based solder bumps on wafers with large dies. Wafer bumping is done by electrodeposition for 150 mm to 200 mm wafers in-house. For larger wafers a coring service will be needed to 200 mm wafer or the work can be outsourced to the company’s production partners. During the wafer bumping process, the solder bumps are grown on each pixel on the ASIC wafer in parallel. The typical interconnect density is higher than 30,000 per cm2 which requires good size and compositional uniformity from the bumps to successfully hybridize the sensor module. The wafer bumping process is a corner stone for fabricating high-quality hybrid sensor modules. The service is available from single wafer prototyping projects to mid-size production of hundreds of wafers per year.